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a Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lighting

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400ml/Piece
400ml/Piece
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Customization: Available
Morphology: Paste-Like
Weight Mixing Ratio: 100:100
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  • a Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lighting
  • a Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lighting
  • a Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lighting
  • a Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lighting
  • a Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lighting
  • a Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lighting
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  • Overview
  • Product Description
  • Product Parameters
  • Detailed Photos
Overview

Basic Info.

Model NO.
TCMP 8825
Surface Drying Time
90 Minutes
Shorea 00
70
Temperature Resistance Range
- 60~ 200
Thermal Conductivity W/Mk
2.5
UL94
V-0
Breakdown Voltage
20 Kv/mm
Transport Package
400ml/Piece
Specification
400mL/piece, 50mL/piece
Trademark
beginor
Origin
China
HS Code
39100000
Production Capacity
100000

Packaging & Delivery

Package Size
29.00cm * 17.00cm * 25.00cm
Package Gross Weight
1.000kg
Lead Time
3 days (1 - 1 400ml)
To be negotiated ( > 1 400ml)

Product Description

a Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lighting
Product Description
 BESIL TCMP
8825 Gap Filler 2.5 W/mK
Feature
   1:1 mixing (thixotropic)
   With glass powder inside
   0.15mm minimal thickness
   Low stress application
   Easy to operate
   Heating acceleration reaction
   Low hardness and micro-stick
   Platinum catalyzed and the siloxane volatiles are extremely low
   ROHS, halogen free, REACH certified
Application
   Lithium battery
   vehicle electronics
   Communication facility
   Computer and peripheral products
   Application between heat source and heat sink

Product description
Liquid Thermal Conductivity Gap Filler TCMP 8825 is 2.5 W/mK , thixotropic  low stress  applications,  designed  to  provide  enhanced  thermal  management  for advanced  automotive  batteries,  automotive  electronics,  and  communications equipment. Compared with traditional materials, it provides enhanced reliability and  rework ability.  Liquid Thermal Conductivity Gap Filler is a  highly adaptable material  that   is   easy  to   use,  eliminates  assembly  tolerances,   makes  the components on  production almost low compression, protects solder joints and Other components . The liquid thermal gel gasket can be perfectly reworked and repaired,  significantly  reducing  the  overall  cost.  The  automatically  controlled feeding can significantly reduce waste and reduce the overall cost again . It is a two-component fast curing liquid thermal gel gasket. Fully automated assembly is possible, corresponding to the thermal interface materials of Industry 4.0.

Data Sheet:
  TCMP(8825)    METHOD UNIT
Color Part A Blue Visual  
Color Part B White Visual  
Features Soft gel  - -
Density(A , B , A+B) 2.95±0.05 ASTMD792 g/cm3
Before-curing performance
A : B 100 : 100 - -
Mixed viscosity (96#,20rpm) A380 /B300 /A+B=320 ASTMD2196 P.s
Shelf life@ 25ºC 9 month month  
After-curing performance
Color Blue                                          Visual               
Working Time 45 mins /25ºC  
Curing condition 5 hrs /25ºC  
Curing condition 20 mins /80ºC or 10 mins/        100ºC  
Hardness Shore 00 = 70                            ASTMD2240  
  Asker C = 40 JIS K7312  
Tensile strength 0.3 ASTMD412 Mpa
Elongation 150 ASTMD412 %
Coefficient of Thermal Expension 150 ASTM E831 ppm/K
Operating temperature -60~200   ºC
Electrical performance
Breakdown voltage 20 ASTM D149 KV/mm
Volume resistance 0.5*1014 ASTM D257 Ohm-cm
Dielectric constant 4.80 ASTM D150 (1KHz)
Flammability rating V-0 UL94 1.5mm
Thermal performance
Thermal Conductivity 2.5 ASTM D5470  W/m*K
Specific heat capacity 1 ASTM E1269 J/g-K

Packing specification
      50ml/Dual Cartridge   (A 25ml ,B 25ml)
      400ml/Dual Cartridge   (A 200ml ,B 200ml)
      Part A: 35 kg/barrel; Part B: 35kg/barrel
Product Parameters
Detailed Photos
a Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lightinga Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lighting
a Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lightinga Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lightinga Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lightinga Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lighting
a Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lightinga Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lightinga Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lightinga Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lightinga Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lightinga Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lightinga Bonding Type Thermal Conductive Filler with a Thermal Conductivity of 3.5 W/M·K Is Used for Heat Dissipation in LED Solid-State Lighting
1. Are you a factory or trading company?
Yes. We are factory focus on the development and application of polymer materials and high-end electronic adhesives.

2.Any OEM/ODM service ?
 BEGINOR can offer the customer OEM and ODM  service,and will give the protection of the your right in your market.

3.How to be beginor's distributor ?
As the growing of beginor's global business,we need to find more and more distributors and agents worldwide. BEGIONR will provide the best solution and service for our partners. For more information, pls contact with us directly
 
4.How to get  samples ?
Contact with us to get  samples
 
5.Delivery time ?
Normally, delivery time of sample order is 3 to 7 days, standard order is 7-20 days.
 
6. How to proceed an order?
Firstly let us know your requirements. Secondly we quote according to your requirements or our
suggestions. Thirdly customer confirmed the details and pay deposit for order. Fourthly we arrange
the production then you pay balance to us before shipment.

7. Shipment:
By Express: DHL, UPS, Fedex, TNT, EMS, Ect.
If your order is big, we'll advise you to use Air or Sea shipping through your nominated forwarder
agent.Our long-term cooperated agent is also available.

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